TI & ADI focused QC · Service levels
We focus on TI and ADI only. QC is a service you request: we verify parts with our in-house process, organized in six layers from basic to in-depth. You choose how deep it goes, and we suggest a level based on the part and its source. We are an independent distributor and not an ISO/IEC 17025 accredited laboratory. Results are documented in our own inspection records.
Six-layer inspection process
Layers 1–2, the non-destructive items of layer 3 and the preliminary dimension check of layer 4 are available on request (G1); layer 3 solvent tests and layers 5–6 are coming soon.
| Layer | What we check |
|---|---|
| 1 Documents & labels | Check paperwork, source records and OEM labels; compare barcode data with printed text. |
| 2 Packaging & moisture | Check OEM packing, moisture-sensitive protection status and tape & reel. |
| 3 Appearance & marking | Magnified check of marking, surface and leads against TI / ADI public documents. |
| 4 Package & dimensions | Verify package type and pin count; measure key outline dimensions. |
| 5 Non-destructive testingComing soon | X-ray for internal structure, XRF for plating composition, without damaging parts. |
| 6 Electrical & decapsulationComing soon | Die marking after decapsulation, electrical signature comparison and solderability; samples are consumed. |
Level comparison
| Level | Layers included | Destructiveness | Report | Status |
|---|---|---|---|---|
| G1 Basic Verification | 1–2, non-destructive items of 3, preliminary dimension check of 4 | Non-destructive | Inspection record with photos | Available on request |
| G2 Standard Inspection | 1–5 | Limited sample consumption | G1 plus X-ray images and XRF results | Coming soon |
| G3 In-depth Inspection | 1–6 (decapsulation) | Destructive | G2 plus die photos | Coming soon |
| G4 Extended Inspection | 1–6 (all) | Destructive | G3 plus electrical comparison and solderability results | Coming soon |
When to use which level
Standards we inspect to
Every check is made against published industry standards and OEM documents (TI and ADI public datasheets, package drawings and marking guides). The table lists the standard behind each check; see the level pages for what each level includes.
| Standard | Used for | From level |
|---|---|---|
| IDEA-STD-1010 | Visual inspection of open-market components (checklist) | G1 |
| IPC/JEDEC J-STD-033 | Handling, packing and storage of moisture-sensitive devices | G1 |
| IPC/JEDEC J-STD-020 | Moisture sensitivity level classification | G1 |
| JEDEC JESD22-B100 | Outline dimensions | G1 |
| JEDEC JESD22-B101 | External visual inspection | G1 |
| JEDEC JESD22-B108 | Lead coplanarity | G1 |
| IPC/JEDEC J-STD-609 | Lead-free and environmental marking | G1 |
| JEDEC JESD625 | Handling of electrostatic-sensitive devices | G1 |
| JEDEC JESD22-B107 | Marking permanency (solvent resistance) | G2 |
Notes
G2, G3 and G4 consume samples; we confirm sample and deliverable quantities with the customer in writing beforehand. Conclusions cover only the samples and items actually inspected. Inspection records are kept with each lot and can be provided by inspection number.
Our process is designed with reference to SAE AS6081; we are not certified to it. The standards behind each check are listed under “Standards we inspect to” above.